Samsung Foundry has shifted its 1.4-nanometre chip manufacturing debut to 2029, focusing on refining and commercialising its 2-nanometre family to enhance yields and volume, while adopting advanced EUV photomask technologies.
Samsung Foundry has pushed back the planned debut of its 1.4-nanometre process to 2029, according to reporting cited from Tom’s Hardware at the NGL 2026 conference. The move signals a deliberate shift in emphasis towards refining and commercialising the company’s 2-nanometre family before moving on to a newer manufacturing node.
That 2-nanometre range is expected to include several variants, among them SF2P, SF2X, SF2A and SF2Z. Samsung’s decision appears aimed at improving yields, the industry term for the proportion of chips that come off a production line usable, while building volume around a process that is more mature and commercially viable. The timing also fits with the company’s long-term supply agreement with Tesla, which is set to run through 2033 for AI5 and AI6 processors.
The company is also preparing to adopt pellicles on EUV photomasks, a technical change that can affect production flow and the scheduling of future nodes. According to the same reporting, Samsung now expects high-numerical-aperture EUV, or High-NA EUV, to enter commercial production only at the 1-nanometre class around 2030, rather than at 2 nanometres or 1.4 nanometres. Chang Min Park, a Samsung Electronics vice-president, said at the event that the company had intended to use High-NA EUV earlier, but that the technology still needs further development before it becomes essential. The approach is more cautious than Intel’s, which plans to use High-NA EUV in its 14A process, and broadly closer to TSMC’s view that wider deployment is likely to come later in the decade.
Disclaimer: This content is intended for informational purposes only. Readers are advised to exercise their own judgement, conduct due diligence, or consult a qualified expert before acting on any information provided.
