GlobalFoundries will produce silicon interposers at its Malta, New York site for TSMC’s CoWoS packaging ecosystem, with volume production expected from 2028.
GlobalFoundries has struck an agreement with TSMC that would create a US-based supply line for silicon interposers used in advanced packaging for artificial intelligence and high-performance computing systems. According to the company, the work will be carried out at its Malta, New York site and is intended to support TSMC’s CoWoS packaging ecosystem, which has become a central part of the supply chain for AI accelerators and other complex chips.
The arrangement gives GlobalFoundries a manufacturing role in a part of the semiconductor stack that sits between chiplets and memory, rather than in leading-edge logic production itself. Tom’s Hardware reported that the deal is worth about $2 billion over five years, although neither company has disclosed the full commercial terms, the planned capacity, or how responsibilities will be divided across packaging, bonding and testing. The publication also said the first volume production is expected to begin in the first half of 2028.
GlobalFoundries said the Malta site will be expanded over time, with the aim of making the first US source of silicon interposers that support advanced packaging technologies, including embedded deep trench capacitor components. Ed Kaste, senior vice-president of CMOS business at GlobalFoundries, said in the company’s announcement that advanced packaging is becoming increasingly important for performance, power efficiency and scale in next-generation AI systems, and that the new arrangement would provide a secure and scalable domestic supply option.
The new supply agreement also fits into GlobalFoundries’ broader investment plan in New York. Earlier this year, the company announced an advanced packaging and testing centre at Malta, backed by support from the State of New York and the US Department of Commerce, which is designed to handle packaging and testing for chips made in the United States. Tom’s Hardware reported that GlobalFoundries has separately outlined a $575 million facility and additional research spending for this work, underlining how the company is positioning itself as a packaging and photonics partner for customers seeking more of their semiconductor production onshore.
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